DocumentCode
3627077
Title
Wetting Force Measurement of the Different Types of Solders and Testing Materials
Author
Karel Dusek;Jan Urbanek;Pavel Mach;Jaromir Drapala
Author_Institution
Czech Technical University in Prague, Faculty of Electrical Engineering, Department of Electrotechnology, Technick? 2, Prague 6, 166 27, Czech Republic. Email: dusekk1@fel.cvut.cz
fYear
2007
fDate
5/1/2007 12:00:00 AM
Firstpage
167
Lastpage
170
Abstract
We have used one of the most commonly used wetability evaluation methods -wetting balance (meniscograph) method to measure the wetting force. We have made a modification of the measuring equipment to measure a less quantity of the solder. We have measured a combination of different types of the lead and lead-free solders and different types of the testing materials. The measurement was carried out on nine different types of solders (Sn63Pb37, Sn95Sb5, Sn95Sb3,5Cul,5, Sn96Ag4, Sn95,5Ag3,8Cu0,7, Sn97Bi2Cul, Sn97Cu3, Sn99Cul, Sn99,75), three types of testing materials (copper, nickel and brass) and three types of fluxes. All measurements nine solders ware measured in ambient atmosphere and two lead-free solders were (Sn96Ag4, Sn95,5Ag3,8CuO,7) measured in inert atmosphere. The results of measurements we classified into the table according to he shape of wetting curve and according to the visual control.
Keywords
"Force measurement","Materials testing","Atmospheric measurements","Environmentally friendly manufacturing techniques","Lead","Atmosphere","Shape measurement","Shape control","Copper","Nickel"
Publisher
ieee
Conference_Titel
Electronics Technology, 30th International Spring Seminar on
ISSN
2161-2528
Print_ISBN
978-1-4244-1217-4
Electronic_ISBN
2161-2064
Type
conf
DOI
10.1109/ISSE.2007.4432841
Filename
4432841
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