• DocumentCode
    3627077
  • Title

    Wetting Force Measurement of the Different Types of Solders and Testing Materials

  • Author

    Karel Dusek;Jan Urbanek;Pavel Mach;Jaromir Drapala

  • Author_Institution
    Czech Technical University in Prague, Faculty of Electrical Engineering, Department of Electrotechnology, Technick? 2, Prague 6, 166 27, Czech Republic. Email: dusekk1@fel.cvut.cz
  • fYear
    2007
  • fDate
    5/1/2007 12:00:00 AM
  • Firstpage
    167
  • Lastpage
    170
  • Abstract
    We have used one of the most commonly used wetability evaluation methods -wetting balance (meniscograph) method to measure the wetting force. We have made a modification of the measuring equipment to measure a less quantity of the solder. We have measured a combination of different types of the lead and lead-free solders and different types of the testing materials. The measurement was carried out on nine different types of solders (Sn63Pb37, Sn95Sb5, Sn95Sb3,5Cul,5, Sn96Ag4, Sn95,5Ag3,8Cu0,7, Sn97Bi2Cul, Sn97Cu3, Sn99Cul, Sn99,75), three types of testing materials (copper, nickel and brass) and three types of fluxes. All measurements nine solders ware measured in ambient atmosphere and two lead-free solders were (Sn96Ag4, Sn95,5Ag3,8CuO,7) measured in inert atmosphere. The results of measurements we classified into the table according to he shape of wetting curve and according to the visual control.
  • Keywords
    "Force measurement","Materials testing","Atmospheric measurements","Environmentally friendly manufacturing techniques","Lead","Atmosphere","Shape measurement","Shape control","Copper","Nickel"
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology, 30th International Spring Seminar on
  • ISSN
    2161-2528
  • Print_ISBN
    978-1-4244-1217-4
  • Electronic_ISBN
    2161-2064
  • Type

    conf

  • DOI
    10.1109/ISSE.2007.4432841
  • Filename
    4432841