Optimization of Testing Methods for Investigation of Joints Quality Based on Vapour Phase Lead-free Soldering

Benchmarking of solder joints quality is a result of evaluation of more parameters. Solder paste and reflowed solder parameters, solder paste printing process, reflow process, components and PCBs surface finishes are the most important of them. Benchmarking the all Surface Mount Technology process with optimal techniques and methods provides a baseline of information that is key to effective process troubleshooting, manufacturability improvements and defect reduction. The developed benchmark test board features a design (the board and stencil pattern) with features for measuring solder physical, electrical and mechanical properties. Effect of different boards and components finishes, as well as effect of thermal cycling (effect of ageing) on structure and subsequently on mechanical and physical properties includes the intent of the board design. Based on these needs a comprehensive test board has been developed, which integrates testing of all the mentioned properties into a single multipurpose board design.