Title :
Implementation of Ecological Technologies in Electronics Industry based on RESPLATEPE Research Project
Author :
N. D. Codreanu;I. Plotog;P. Svasta;C. Turcu;G. Varzaru;D. Pitica;M. Gavan;A. Bara;C. Farcas; Al Marin;T.C. Cucu
Author_Institution :
POLITEHNICA University of Bucharest, Center of Technological Electronics and Interconnection Techniques (UPB-CETTI), Splaiul Independentei no. 313, Bucharest, Romania. e-mail: norocel.codreanu@cetti.ro
fDate :
5/1/2007 12:00:00 AM
Abstract :
The paper presents the applied research performed in the frame of RESPLATEPE Romanian CEEX national project destined to implementation of ecological technologies in electronics industry, based on based on RoHS and WEEE directives [3]. The work represents a multi-criteria approach in electronics packaging and emphasizes the activity of eight research partners involved in various phases of electronic manufacturing process. Under work are activities regarding electrical, rheological, climatic, and mechanical testing of experimental ecological modules and structures (the relative humidity controller presented in this contribution being one example) developed in the first stage. After them, the team will perform investigations of signals parameters, environmental factors and interconnection technologies influences on ecological electronic modules developed or destined for future development.
Keywords :
"Electronics industry","Environmentally friendly manufacturing techniques","Lead","Consumer electronics","Assembly","Marine technology","Electronics packaging","Testing","Metallization","Copper alloys"
Conference_Titel :
Electronics Technology, 30th International Spring Seminar on
Print_ISBN :
978-1-4244-1217-4
Electronic_ISBN :
2161-2064
DOI :
10.1109/ISSE.2007.4432860