Title :
Thermal challenges in 3-D stacked packaging
Author :
Venkat Natarajan
Author_Institution :
Intel India Pvt. Ltd., Bangalore, India
Keywords :
"Electronic packaging thermal management","Heat transfer","Electronics industry","Publishing"
Conference_Titel :
Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on
Print_ISBN :
978-2-35500-002-7
DOI :
10.1109/THERMINIC.2007.4451736
