Title :
Copper-filled macroporous Si for microchannel heat sink tecnology
Author :
Filimon Zacharatos;Androula Nassiopoulou
Author_Institution :
IMEL, NCSR ?Demokritos?, Greece
Keywords :
"Microchannel","Heat sinks","Printing","Publishing"
Conference_Titel :
Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on
Print_ISBN :
978-2-35500-002-7
DOI :
10.1109/THERMINIC.2007.4451747
