• DocumentCode
    3627366
  • Title

    Vibration combined high Temperature Cycle Tests for capacitive MEMS accelerometers

  • Author

    Z. Szucs;G. Nagy;S. Hodossy;M. Rencz;A. Poppe

  • Author_Institution
    Budapest University of Technology and Economics, Department of Electron Devices, H-1521, Goldmann Gy?rgy t?r 3., Hungary
  • fYear
    2007
  • Firstpage
    215
  • Lastpage
    219
  • Abstract
    In this paper vibration combined high temperature cycle tests for packaged capacitive SOI-MEMS accelerometers are presented. The aim of these tests is to provide useful Design for reliability information for MEMS designers. A high temperature test chamber and a chopper-stabilized read-out circuitry were designed and realized at BME-DED. Twenty thermal cycles of combined temperature cycle test and fatigue vibration test has been carried out on 5 samples. Statistical evaluation of the test results showed that degradation has started in 3 out of the 5 samples.
  • Keywords
    "Micromechanical devices","Accelerometers","Circuit testing","Temperature sensors","Acceleration","Vibrations","Fatigue","Temperature dependence","Integrated circuit reliability","Electron devices"
  • Publisher
    ieee
  • Conference_Titel
    Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on
  • Print_ISBN
    978-2-35500-002-7
  • Type

    conf

  • DOI
    10.1109/THERMINIC.2007.4451781
  • Filename
    4451781
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3627366