Title :
Thermal noise measurement of SI integrator
Author :
Andrzej Handkiewicz;Pawel Sniatala;Radoslaw Rudnicki;Jacek Pierzchlewski
Author_Institution :
Faculty of Computing and Management, Pozna? University of Technology, ul. Piotrowo 3a, Poland
Abstract :
Analysis and measurement of the integrator noise are presented. An experimental chip in 0.35 mum CMOS technology was fabricated and measurements are compared to results obtained during analysis and simulation.
Keywords :
"Noise measurement","Circuit noise","CMOS technology","Frequency","Autocorrelation","Sampling methods","Thermal management of electronics","Semiconductor device measurement","Integrated circuit measurements","Switches"
Conference_Titel :
Signals and Electronic Systems, 2008. ICSES ´08. International Conference on
Print_ISBN :
978-83-88309-47-2
DOI :
10.1109/ICSES.2008.4673364
