• DocumentCode
    3629572
  • Title

    Thermal noise measurement of SI integrator

  • Author

    Andrzej Handkiewicz;Pawel Sniatala;Radoslaw Rudnicki;Jacek Pierzchlewski

  • Author_Institution
    Faculty of Computing and Management, Pozna? University of Technology, ul. Piotrowo 3a, Poland
  • fYear
    2008
  • Firstpage
    85
  • Lastpage
    88
  • Abstract
    Analysis and measurement of the integrator noise are presented. An experimental chip in 0.35 mum CMOS technology was fabricated and measurements are compared to results obtained during analysis and simulation.
  • Keywords
    "Noise measurement","Circuit noise","CMOS technology","Frequency","Autocorrelation","Sampling methods","Thermal management of electronics","Semiconductor device measurement","Integrated circuit measurements","Switches"
  • Publisher
    ieee
  • Conference_Titel
    Signals and Electronic Systems, 2008. ICSES ´08. International Conference on
  • Print_ISBN
    978-83-88309-47-2
  • Type

    conf

  • DOI
    10.1109/ICSES.2008.4673364
  • Filename
    4673364
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3629572