• DocumentCode
    3629687
  • Title

    Application of FPGA units in combined temperature cycle and vibration reliability tests of lead-free interconnections

  • Author

    Przemyslaw Matkowski;Krzysztof Urbanski Tomasz Falat;Jan Felba;Zbigniew Zaluk;Rafal Zwierta;Abhijit Dasgupta;Michael Pecht

  • Author_Institution
    Wroclaw University of Technology, Poland
  • fYear
    2008
  • Firstpage
    1375
  • Lastpage
    1380
  • Abstract
    According to the European Directive 2002/95/EC RoHS solders that contain lead have to be replaced with lead-free equivalents. Replacing well-known materials with new materials not only force technological adaptations but also force necessity of reliability investigations, especially new failure modes.
  • Keywords
    "Field programmable gate arrays","Temperature","Testing","Environmentally friendly manufacturing techniques","Lead","Soldering","Electrical resistance measurement","Stress","Vibration measurement","Materials reliability"
  • Publisher
    ieee
  • Conference_Titel
    Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
  • Print_ISBN
    978-1-4244-2813-7
  • Type

    conf

  • DOI
    10.1109/ESTC.2008.4684556
  • Filename
    4684556
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3629687