Title :
Application of FPGA units in combined temperature cycle and vibration reliability tests of lead-free interconnections
Author :
Przemyslaw Matkowski;Krzysztof Urbanski Tomasz Falat;Jan Felba;Zbigniew Zaluk;Rafal Zwierta;Abhijit Dasgupta;Michael Pecht
Author_Institution :
Wroclaw University of Technology, Poland
Abstract :
According to the European Directive 2002/95/EC RoHS solders that contain lead have to be replaced with lead-free equivalents. Replacing well-known materials with new materials not only force technological adaptations but also force necessity of reliability investigations, especially new failure modes.
Keywords :
"Field programmable gate arrays","Temperature","Testing","Environmentally friendly manufacturing techniques","Lead","Soldering","Electrical resistance measurement","Stress","Vibration measurement","Materials reliability"
Conference_Titel :
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Print_ISBN :
978-1-4244-2813-7
DOI :
10.1109/ESTC.2008.4684556
