• DocumentCode
    3631762
  • Title

    Sensitivity of output response to geometrical dimensions in VLSI interconnects

  • Author

    Agnieszka Ligocka-Wardzinska;Wojciech Bandurski

  • Author_Institution
    Poznan University of Technology, Poland
  • fYear
    2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The paper presents a sensitivity analysis of step and ramp response of VLSI interconnects to geometrical dimensions of microstrip model of higher level interconnects. The method is based on analytical form of VLSI output response calculated using multiple scales method.
  • Keywords
    "Very large scale integration","Integrated circuit interconnections","Solid modeling","Inductance","Microstrip","Impedance","Power transmission lines","Differential equations","Power system interconnection","Paper technology"
  • Publisher
    ieee
  • Conference_Titel
    Signal Propagation on Interconnects, 2009. SPI ´09. IEEE Workshop on
  • Print_ISBN
    978-1-4244-4490-8
  • Type

    conf

  • DOI
    10.1109/SPI.2009.5089863
  • Filename
    5089863
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3631762