Title :
Challenges and novel approaches for photo resist removal and post-etch residue removal for 22 nm interconnects
Author :
P.W. Mertens;T.-G. Kim;M. Claes;Q. T. Le;G. Vereecke;E. Kesters;S. Suhard;A. Pacco;M. Lux;K. Kenis;A. Urbanowicz;Zs. Tokei;G. Beyer
Author_Institution :
IMEC, Kapeldreef 75, B-3001, Leuven (Belgium)
Abstract :
The critical challenges of removal of post metal hard mask etch photo resist removal and post low-k etch residue removal are described. An overview of some new non-plasma based approaches is presented.
Keywords :
"Resists","Solvents","Etching","Plasma applications","Polymers","Dielectric materials","Cleaning","Organic materials","Plasma chemistry","Plasma materials processing"
Conference_Titel :
Interconnect Technology Conference, 2009. IITC 2009. IEEE International
Print_ISBN :
978-1-4244-4492-2
Electronic_ISBN :
2380-6338
DOI :
10.1109/IITC.2009.5090397
