DocumentCode :
3632501
Title :
A development alliance and manufacturing platform business model for robust chip offerings
fYear :
2009
Firstpage :
1
Lastpage :
1
Keywords :
"Virtual manufacturing","Robustness","Semiconductor device manufacture","Technology management","Engineering management","Qualifications","Foundries","Integrated circuit reliability","Microelectronics","Logistics"
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 2009 IEEE International
ISSN :
1541-7026
Print_ISBN :
978-1-4244-2888-5
Electronic_ISBN :
1938-1891
Type :
conf
DOI :
10.1109/IRPS.2009.5173203
Filename :
5173203
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3632501