Title :
Analysis of intermetallic compounds in lead-free solders
Author :
Alena Pietrikova;Juraj Durisin;Jan Urbancik;Juraj Bansky
Author_Institution :
Department of Technologies in Electronics, Faculty of Electrical Engineering and Informatics, Technical University of Ko?ice, Letn? 9, 042 00, Slovakia
fDate :
5/1/2009 12:00:00 AM
Abstract :
Intermetallic compounds (IMCs) are essential part of lead-free solders microstructure. In 96.5Sn3Ag0.5Cu (SAC305) solder is dominant element tin (Sn). But despite this Sn dominancy only 3% weight contain of silver (Ag) has influence on final structure of solid solder joint. Fundamental impact on strength properties of solder joint has also interaction between the solder and printed circuit board (PCB) pad. Another important factor is effect of ageing process. Analysis of presence of IMCs in solder joints is essential key to understand behaviour of the lead-free solder joints.
Keywords :
"Intermetallic","Lead compounds","Environmentally friendly manufacturing techniques","Tin","Microstructure","Surface finishing","Reflow soldering","Temperature","Informatics","Silver"
Conference_Titel :
Electronics Technology, 2009. ISSE 2009. 32nd International Spring Seminar on
Print_ISBN :
978-1-4244-4260-7
Electronic_ISBN :
2161-2064
DOI :
10.1109/ISSE.2009.5207047
