Title :
Bonding in 3D structure
Author :
Petr Kosina;Edita Hejatkova;Josef Sandera
Author_Institution :
Department of Microelectronic, Brno University of Technology, ?doln? 53, 602 00 Brno, Czech Republic
fDate :
5/1/2008 12:00:00 AM
Abstract :
This paper is focused on the creation of bonding on a ceramic substrate medium, which can be applied in 3D structure (LTCC-low temperature co-fired ceramic), and on the measurement of its reliability. One of the methods which can be used to create a conductive connection between particular layers is described. The method enables to create complex circuitry and to increase the density of entities on the surface. The aim is to create the conductive connection of high reliability, because can not be nondestructive dissolution resultant structure.
Keywords :
"Bonding","Printing","Temperature","Ceramics","Substrates","Technological innovation","Printed circuits","Thin film circuits","Thick films","Thickness measurement"
Conference_Titel :
Electronics Technology, 2008. ISSE ´08. 31st International Spring Seminar on
Print_ISBN :
978-1-4244-3973-7;978-1-4244-3972-0
Electronic_ISBN :
2161-2064
DOI :
10.1109/ISSE.2008.5276619
