Title :
Impact of solder pad shape on lead-free solder joint reliability
Author :
Cyril Vasko;Marek Novotny;Ivan Szendiuch
Author_Institution :
Department of Microelectronics, Brno University of Technology, Czech Republic
Abstract :
This paper deals with hand lead-free soldering process optimization. The work is focused on the impact of solder pads shape in combination with solder pads finish on lead-free solder joints reliability.
Keywords :
"Shape","Environmentally friendly manufacturing techniques","Lead","Soldering","Testing","Thermal stresses","Surface finishing","Mechanical factors","Electric shock","Manufacturing processes"
Conference_Titel :
Electronics Technology, 2008. ISSE ´08. 31st International Spring Seminar on
Print_ISBN :
978-1-4244-3973-7;978-1-4244-3972-0
Electronic_ISBN :
2161-2064
DOI :
10.1109/ISSE.2008.5276645
