Title :
Microstructure analysis and measurement of nonlinearity of vapour phase reflowed solder joints
Author :
A. Pietrikova;P. Mach;J. Durisin;E. Livovsky;J. Urbancik
Author_Institution :
Faculty of Electrical Engineering and Informatics, Technical University of Kosice, Letna 9, 042 00 Kosice, Slovakia
Abstract :
The goal of the study is to compare quality of lead-free vapour phase reflowed solder joints soldered on different printed circuit board (PCB) surface finishes. The solder joints quality comparison is based on evaluation of microstructure development of the solder, solder/PCB pad interface and on the measurement of the solder joints nonlinearity of the current-voltage (C-V) characteristics. The microstructure is evaluated before and after accelerated ageing.
Keywords :
"Microstructure","Phase measurement","Soldering","Environmentally friendly manufacturing techniques","Lead","Printed circuits","Surface finishing","Current measurement","Capacitance-voltage characteristics","Accelerated aging"
Conference_Titel :
Electronics Technology, 2008. ISSE ´08. 31st International Spring Seminar on
Print_ISBN :
978-1-4244-3973-7;978-1-4244-3972-0
Electronic_ISBN :
2161-2064
DOI :
10.1109/ISSE.2008.5276669
