Title :
Vapour soldering system with peltier heater
Author :
Mai Lam Do;Martin Novak;Ivan Uhlir
Author_Institution :
Czech Technical University in Prague, Faculty of Mechanical Engineering, Department of Instrumentation and Control Engineering, Technick? 4, 166 07, Czech republic
Abstract :
A system using Peltier heater is provided for vapour phase soldering of components on PCB, system with increasing heating and cooling speed of the components and PCB lands that are to be soldered together. Vapour phase soldering (VPS) uses the latent heat of liquid vaporization to provide heat for soldering. This latent heat is released as the vapour of the inert liquid condenses on components and PCB lands. The peak soldering temperature is the boiling temperature of the inert liquid at atmospheric pressure.
Keywords :
"Soldering","Temperature","Lead","Heat engines","Assembly","Packaging","Thermal stresses","Surface contamination","Mechanical engineering","Instruments"
Conference_Titel :
Applied Electronics, 2009. AE 2009
Print_ISBN :
978-80-7043-781-0
