• DocumentCode
    3634862
  • Title

    Mathematically simulated process of evaporation of thin NiCr films

  • Author

    Pavel Mach;Tomáš Rozkošný;David Bušek

  • Author_Institution
    Department of Electrotechnology, Faculty of Electrical Engineering, Czech Technical University in Prague, Prague 6, Czech Republic
  • fYear
    2009
  • Firstpage
    211
  • Lastpage
    214
  • Abstract
    Process of evaporation of thin NiCr resistive films on glass substrates has been simulated using DOE. The resistance of evaporated films has been calculated using a mathematical model based on three technological factors: the temperature of the substrate, the pressure and the time of evaporation. The model has been found using factorial experiments of the type 23. It has been found very good correspondence between the resistance values calculated using the model and found experimentally.
  • Keywords
    "Substrates","Sputtering","Transistors","Mathematical model","Resistors","Fabrication","Chemical technology","Electronics packaging","Glass","US Department of Energy"
  • Publisher
    ieee
  • Conference_Titel
    Design and Technology of Electronics Packages, (SIITME) 2009 15th International Symposium for
  • Print_ISBN
    978-1-4244-5132-6
  • Type

    conf

  • DOI
    10.1109/SIITME.2009.5407372
  • Filename
    5407372