DocumentCode
3634862
Title
Mathematically simulated process of evaporation of thin NiCr films
Author
Pavel Mach;Tomáš Rozkošný;David Bušek
Author_Institution
Department of Electrotechnology, Faculty of Electrical Engineering, Czech Technical University in Prague, Prague 6, Czech Republic
fYear
2009
Firstpage
211
Lastpage
214
Abstract
Process of evaporation of thin NiCr resistive films on glass substrates has been simulated using DOE. The resistance of evaporated films has been calculated using a mathematical model based on three technological factors: the temperature of the substrate, the pressure and the time of evaporation. The model has been found using factorial experiments of the type 23. It has been found very good correspondence between the resistance values calculated using the model and found experimentally.
Keywords
"Substrates","Sputtering","Transistors","Mathematical model","Resistors","Fabrication","Chemical technology","Electronics packaging","Glass","US Department of Energy"
Publisher
ieee
Conference_Titel
Design and Technology of Electronics Packages, (SIITME) 2009 15th International Symposium for
Print_ISBN
978-1-4244-5132-6
Type
conf
DOI
10.1109/SIITME.2009.5407372
Filename
5407372
Link To Document