• DocumentCode
    3637100
  • Title

    Performance and characterization of MMIC phase shifter with wire bonds interconnections

  • Author

    Piotr Szymański

  • Author_Institution
    Telecommunication Research Institute, PIT S.A, Warsaw, Poland
  • fYear
    2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper presents some aspects of bond wire interconnections and its affect on the performance of a 6-bit phase shifter. The phase shifter operates in S-band and was connected to Rogers RO4003 substrate by the means of ball bonds. Discontinuities introduced by the interconnections were modeled as a low pass network. This non-optimal bonding worsened scattering parameters of the phase shifter by ~ 15%.
  • Keywords
    "MMICs","Phase shifters","Wire","Integrated circuit interconnections","Bonding","Inductance","Impedance","Packaging","Scattering parameters","Electromagnetic heating"
  • Publisher
    ieee
  • Conference_Titel
    Microwave Radar and Wireless Communications (MIKON), 2010 18th International Conference on
  • Print_ISBN
    978-1-4244-5288-0
  • Type

    conf

  • Filename
    5540378
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3637100