• DocumentCode
    3637266
  • Title

    Contribution to realization of 3D structures

  • Author

    Michal Nicák;Ivan Szendiuch;Josef Šandera

  • Author_Institution
    Department of Microelectronics, Faculty of Electrical Engineering and Communication, Brno University of Technology, Ú
  • fYear
    2010
  • Firstpage
    156
  • Lastpage
    159
  • Abstract
    This paper describes design, construction and some recent test results of lead-free soldered three-dimensional structures based on combination of stacked thick-film Al2O3 or LTCC and FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls. This three dimensional technology offers great potential to very compact embedded structures which may include as hybrid integrated circuits (HIC) well as non-conventional applications (sensors, attenuators etc).
  • Keywords
    "Substrates","Three dimensional displays","Soldering","Springs","Seminars","Printing"
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology (ISSE), 2010 33rd International Spring Seminar on
  • Print_ISBN
    978-1-4244-7849-1
  • Type

    conf

  • DOI
    10.1109/ISSE.2010.5547280
  • Filename
    5547280
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3637266