Title :
Preparation of vibration tests of electrically conductive adhesives and leadfree solders
Author :
Marek Tučan;Pavel Zák;Jan Urbánek
Author_Institution :
Czech Technical University in Prague, Faculty of Electrical Engineering, Department of Electrotechnology, Technická
Abstract :
This article describes preparation of vibration experiments aimed at the reliability of joints manufactured using leadfree soldering and electrically conductive adhesives. To facilitate the experiment, a holder for experimental circuit board had to be designed and manufactured. At the same time, it was needed to set up measurement of acceleration of the specimens to ensure controlled conditions and to calibrate the vibrators. The result of this effort is a holder, designed specifically for standardized circuit boards used at author´s department for a wide range of various experiments connected with surface mount technologies. The holder allows vibrations along three axes. Measurement of vibrations is being performed using simple chip accelerometers, covering all three axes.
Keywords :
"Vibrations","Vibration measurement","Sensors","Accelerometers","Printed circuits","Acceleration","Reliability"
Conference_Titel :
Applied Electronics (AE), 2010 International Conference on
Print_ISBN :
978-80-7043-865-7