Title :
Thermal evaluation of the quality of electrically conductive adhesive joints
Author :
Václav Papez;David Bušek
Author_Institution :
Department of Electrotechnology, Faculty of Electrical Engineering Czech Technical University, Prague 6, 166 27, Czech Republic
Abstract :
This paper deals with electrically conductive adhesives and an innovative quality estimation method based on thermal field evaluation. The resistance of joints heated by passing current can be roughly estimated by the use of temperature field picture. Methodology of calculation of the resistance of the joint, based on a temperature curve across the component is presented.
Keywords :
"Joints","Temperature measurement","Heating","Temperature sensors","Electrical resistance measurement","Thermal resistance"
Conference_Titel :
Applied Electronics (AE), 2010 International Conference on
Print_ISBN :
978-80-7043-865-7