• DocumentCode
    3638338
  • Title

    Simplified modeling and simulation for physical systems circuit design on a multiphysics software exportable to a multi-domain platform

  • Author

    E. N. Vázquez-Acosta;M. A. Reyes-Barranca;S. Mendoza-Acevedo;J.L. González-Vidal

  • Author_Institution
    CINVESTAV-IPN, Electrical Engineering Dept., Mexico D.F., Mexico
  • fYear
    2010
  • Firstpage
    525
  • Lastpage
    530
  • Abstract
    Simulation software is a fundamental tool that should be used when designing systems dealing with electro-thermal interaction, for instance. Nevertheless, there exist some inconveniences that limit and make specific software hard to use in this task. On one side, it may require a large processing hardware capacity, and on the other, simulation time increases substantially if the model complexity and accuracy required is high [1]. This work presents the procedure for modeling and simulating a micro-electro-mechanical system (MEMS) operating with an electro-thermal interaction and implemented with the help of a multi-domain design and simulation platform based on dynamic systems (Simulink® of Matlab®), using the results obtained after several simulations made with a finite elements analysis and engineering software environment, in particular, for simulation and modeling the physical behavior of the system´s elements (COMSOL Mutiphysics®). The main goal of this study is to show a highly convenient alternative from which simulation time can be shortened with reduced hardware requirements, allowing at the same time the outline of possible electronic temperature control blocks, so it can be integrated on a silicon chip.
  • Keywords
    "Solid modeling","Mathematical model","Integrated circuit modeling","Analytical models","Software","Equations","Computational modeling"
  • Publisher
    ieee
  • Conference_Titel
    Electrical Engineering Computing Science and Automatic Control (CCE), 2010 7th International Conference on
  • Print_ISBN
    978-1-4244-7312-0
  • Type

    conf

  • DOI
    10.1109/ICEEE.2010.5608593
  • Filename
    5608593