Title :
Multilayer SMT high power density packaging of electronic ballasts for HID lamps
Author :
I. Josifovic;J. Popovic-Gerber;J.A. Ferreira;D.H.J. van Casteren
Author_Institution :
Delft University of Technology, 2628CD, The Netherlands
Abstract :
This paper presents a method for high power density manufacturing of electronic ballast for HID lamps by utilization of a novel SMT stacked converter construction method, Power Sandwich. A two-stage topology of an HID lamp electronic ballast used in a commercial benchmark is employed as a case study. In Power Sandwich technology, new double-sided SMT x-dim components that have uniform height and enhanced thermal properties are stacked between planar substrates to achieve size reduction and better thermal performance of HID lamp ballast. A Power Sandwich prototype of a 150W HID lamp electronic ballast is developed, which has an electrical performance comparable to the commercially available benchmark counterpart but twice as high power density and better thermal performance.
Keywords :
"High intensity discharge lamps","Inductors","Electronic ballasts","Switches","Capacitors","Loss measurement","Temperature measurement"
Conference_Titel :
Energy Conversion Congress and Exposition (ECCE), 2010 IEEE
Print_ISBN :
978-1-4244-5286-6
DOI :
10.1109/ECCE.2010.5617817