• DocumentCode
    3639145
  • Title

    E-learning packaging technologies course in the frame of the MSYSTECH European project

  • Author

    Mihaela Pantazică;Norocel D. Codreanu;Paul Svasta;Ciprian Ionescu

  • Author_Institution
    "
  • fYear
    2010
  • Firstpage
    317
  • Lastpage
    320
  • Abstract
    The paper presents the e-learning “Packaging Technologies” course developed in the frame of the mSysTech (E-Training Microsystems Technologies) European project. The objective of this multi-media course is to introduce the learners in microsystems packaging technologies, including design, analysis, fabrication, assembling, characterization and testing. In addition, this course will also introduce the most recent developments of micro-/nano-fabrication technologies.
  • Keywords
    "Packaging","Electronics packaging","Solid modeling","Consumer electronics","Plastics","Europe"
  • Publisher
    ieee
  • Conference_Titel
    Design and Technology in Electronic Packaging (SIITME), 2010 IEEE 16th International Symposium for
  • Print_ISBN
    978-1-4244-8123-1
  • Type

    conf

  • DOI
    10.1109/SIITME.2010.5650874
  • Filename
    5650874
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3639145