E-learning packaging technologies course in the frame of the MSYSTECH European project

The paper presents the e-learning “Packaging Technologies” course developed in the frame of the mSysTech (E-Training Microsystems Technologies) European project. The objective of this multi-media course is to introduce the learners in microsystems packaging technologies, including design, analysis, fabrication, assembling, characterization and testing. In addition, this course will also introduce the most recent developments of micro-/nano-fabrication technologies.