Title :
Thermal ageing of electrically conductive micro/nano adhesives
Author :
Pavel Mach;David Bušek
Author_Institution :
Department of Electrotechnology Czech Technical University in Prague, Faculty of Electrical Engineering Prague, Czech Republic
Abstract :
Electrical as well as mechanical properties of electrically conductive adhesives can be modified by addition of different types of nanoparticles. It has been investigated if changes of the resistance of adhesive joints caused by thermal ageing will differ in dependence on the type of nanoparticles added into adhesives. It has been found that adhesive joints formed of adhesives modified such the way have the same dependence of the resistance on the conditions of thermal ageing. That means, that nanoparticles added into adhesive in concentration up to 2,5 % b. w. does not cause changes of an ageing mechanism of adhesive matrix.
Keywords :
"Nanoparticles","Resistance","Silver","Joints","Conductivity","Conductive adhesives","Aging"
Conference_Titel :
Design and Technology in Electronic Packaging (SIITME), 2010 IEEE 16th International Symposium for
Print_ISBN :
978-1-4244-8123-1
DOI :
10.1109/SIITME.2010.5651612