Low-loss, low-cost, IC-to-board bondwire interconnects for millimeter-wave applications

This paper presents a low-cost, low-loss solution for IC-to-board interconnects using bondwires. With an L-C-L structure to compensate the influence of bondwires, low insertion loss and high return loss can be achieved. Optimized at 60 GHz, an insertion loss of 0.1 dB is achieved for the differential connection and 0.3 dB is achieved for the single-ended connection, with additional radial stubs to compensate the influence of the ground bondwire. The 1-dB bandwidth of the interconnect is larger than 10 GHz (16% relative bandwidth at 60 GHz). The low-cost and low-loss characteristic makes the interconnect well suited for millimeter-wave packaging and module design.