Title :
Scaling of SOI FinFETs down to fin width of 4 nm for the 10nm technology node
Author :
J. B. Chang;M. Guillorn;P.M. Solomon;C.-H. Lin;S.U. Engelmann;A. Pyzyna;J. A. Ott;W.E Haensch
Author_Institution :
IBM Research, IBM T.J. Watson Research Center, Yorktown Heights, NY, USA
fDate :
6/1/2011 12:00:00 AM
Abstract :
Using a novel replacement gate SOI FinFET device structure, we have fabricated FinFETs with fin width (DFin) of 4 nm, fin pitch (FP) of 40 nm, and gate length (LG) of 20 nm. With this structure, we have achieved arrays of thousands of fins for DFin down to 4 nm with robust yield and structural integrity. We observe performance degradation, increased variability, and VT shift as DFin is reduced. Capacitance measurements agree with quantum confinement behavior which has been predicted to pose a fundamental limit to scaling FinFETs below 10 nm LG.
Keywords :
"FinFETs","Logic gates","Potential well","Silicon","Quantum capacitance","Capacitance-voltage characteristics"
Conference_Titel :
VLSI Technology (VLSIT), 2011 Symposium on
Print_ISBN :
978-1-4244-9949-6
Electronic_ISBN :
2158-9682