Title : 
Degradation of two-compound Electrically Conductive Adhesive in relation to curing temperature profile
         
        
            Author : 
Marek Tučan;Pavel Žák;Jan Urbánek
         
        
            Author_Institution : 
Czech Technical University in Prague, Faculty of Electrical Engineering, Technická
         
        
        
        
        
            Abstract : 
Electrically Conductive Adhesives (ECAs) are spreading the electronic industry, often deployed in adverse climatic conditions. A series of accelerated climatic experiments was undertaken to gather more information about this technology and its environmental stability. During these tests, an interesting behavior of the two-component ECAs was observed: a sharp drop of electrical resistance in a short time after the curing of the ECA. This indicated a possible problem with the stability of two-component ECAs and mandated further research. Its results are published in this paper and seem to support the validity of the original finding - that there exists a possible risk when using certain conductive adhesives and that manufacturer-supplied curing temperature profiles might, in some cases, be insufficient.
         
        
            Keywords : 
"Resistance","Curing","Temperature","Joints","Temperature measurement","Aging","Resistors"
         
        
        
            Conference_Titel : 
Applied Electronics (AE), 2011 International Conference on
         
        
        
            Print_ISBN : 
978-1-4577-0315-7