DocumentCode :
3644060
Title :
Degradation of two-compound Electrically Conductive Adhesive in relation to curing temperature profile
Author :
Marek Tučan;Pavel Žák;Jan Urbánek
Author_Institution :
Czech Technical University in Prague, Faculty of Electrical Engineering, Technická
fYear :
2011
Firstpage :
1
Lastpage :
4
Abstract :
Electrically Conductive Adhesives (ECAs) are spreading the electronic industry, often deployed in adverse climatic conditions. A series of accelerated climatic experiments was undertaken to gather more information about this technology and its environmental stability. During these tests, an interesting behavior of the two-component ECAs was observed: a sharp drop of electrical resistance in a short time after the curing of the ECA. This indicated a possible problem with the stability of two-component ECAs and mandated further research. Its results are published in this paper and seem to support the validity of the original finding - that there exists a possible risk when using certain conductive adhesives and that manufacturer-supplied curing temperature profiles might, in some cases, be insufficient.
Keywords :
"Resistance","Curing","Temperature","Joints","Temperature measurement","Aging","Resistors"
Publisher :
ieee
Conference_Titel :
Applied Electronics (AE), 2011 International Conference on
ISSN :
1803-7232
Print_ISBN :
978-1-4577-0315-7
Type :
conf
Filename :
6049137
Link To Document :
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