• DocumentCode
    3644131
  • Title

    Shear strength of joints made of lead-free solders

  • Author

    Jiří Podzemský;Jan Urbánek;Karel Dušek

  • Author_Institution
    Faculty of Electrical Engineering, Czech Technical University, Prague, Czech Republic
  • fYear
    2011
  • fDate
    5/1/2011 12:00:00 AM
  • Firstpage
    84
  • Lastpage
    88
  • Abstract
    This paper presents results of mechanical testing of soldered joints made of widely used lead free solder and most popular lead containing one. Measured parameter is shear strength. Tested solders were lead-free Sn-3,8Ag-0,7Cu and lead containing Sn-37Pb. With those solders set of SMD resistors was mounted on pads made of copper and copper electrolytic covered with nickel layer. As mechanical ruggedness of soldered joint strongly depends on presence of intermetallics compounds samples were treated to heat 150°C 250 and 500 hours and shear strength was measured subsequently and values were compared to ones non thermal aged. Thickness of intermetallics compounds and its influence to shear strength was investigated.
  • Keywords
    "Copper","Nickel","Annealing","Joints","Intermetallic","Compounds","Lead"
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology (ISSE), 2011 34th International Spring Seminar on
  • ISSN
    2161-2528
  • Print_ISBN
    978-1-4577-2111-3
  • Electronic_ISBN
    2161-2536
  • Type

    conf

  • DOI
    10.1109/ISSE.2011.6053555
  • Filename
    6053555