DocumentCode :
3644131
Title :
Shear strength of joints made of lead-free solders
Author :
Jiří Podzemský;Jan Urbánek;Karel Dušek
Author_Institution :
Faculty of Electrical Engineering, Czech Technical University, Prague, Czech Republic
fYear :
2011
fDate :
5/1/2011 12:00:00 AM
Firstpage :
84
Lastpage :
88
Abstract :
This paper presents results of mechanical testing of soldered joints made of widely used lead free solder and most popular lead containing one. Measured parameter is shear strength. Tested solders were lead-free Sn-3,8Ag-0,7Cu and lead containing Sn-37Pb. With those solders set of SMD resistors was mounted on pads made of copper and copper electrolytic covered with nickel layer. As mechanical ruggedness of soldered joint strongly depends on presence of intermetallics compounds samples were treated to heat 150°C 250 and 500 hours and shear strength was measured subsequently and values were compared to ones non thermal aged. Thickness of intermetallics compounds and its influence to shear strength was investigated.
Keywords :
"Copper","Nickel","Annealing","Joints","Intermetallic","Compounds","Lead"
Publisher :
ieee
Conference_Titel :
Electronics Technology (ISSE), 2011 34th International Spring Seminar on
ISSN :
2161-2528
Print_ISBN :
978-1-4577-2111-3
Electronic_ISBN :
2161-2536
Type :
conf
DOI :
10.1109/ISSE.2011.6053555
Filename :
6053555
Link To Document :
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