DocumentCode :
3644133
Title :
Correlations between mechanical and electrical parameters of modified electrically conductive adhesives
Author :
David Bušek;Jiřina Šelepová;Pavel Mach
Author_Institution :
Department of Electrotechnology, FEE, Czech Technical University in Prague, Technická
fYear :
2011
fDate :
5/1/2011 12:00:00 AM
Firstpage :
118
Lastpage :
121
Abstract :
In our previous research, only electrical properties in dependence on different substrates and after various straining were measured or only mechanical parameters of a bulk adhesive were observed. The aim of this work is to put in contrast electrical resistance and mechanical properties (shear strength) of joints realized using electrically conductive adhesives. Two types of 2-component adhesives and seven modifications of two single-component adhesives were tested.
Keywords :
"Resistance","Silver","Conductive adhesives","Electrical resistance measurement","Carbon nanotubes","Joints","Curing"
Publisher :
ieee
Conference_Titel :
Electronics Technology (ISSE), 2011 34th International Spring Seminar on
ISSN :
2161-2528
Print_ISBN :
978-1-4577-2111-3
Electronic_ISBN :
2161-2536
Type :
conf
DOI :
10.1109/ISSE.2011.6053562
Filename :
6053562
Link To Document :
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