Title :
Correlations between mechanical and electrical parameters of modified electrically conductive adhesives
Author :
David Bušek;Jiřina Šelepová;Pavel Mach
Author_Institution :
Department of Electrotechnology, FEE, Czech Technical University in Prague, Technická
fDate :
5/1/2011 12:00:00 AM
Abstract :
In our previous research, only electrical properties in dependence on different substrates and after various straining were measured or only mechanical parameters of a bulk adhesive were observed. The aim of this work is to put in contrast electrical resistance and mechanical properties (shear strength) of joints realized using electrically conductive adhesives. Two types of 2-component adhesives and seven modifications of two single-component adhesives were tested.
Keywords :
"Resistance","Silver","Conductive adhesives","Electrical resistance measurement","Carbon nanotubes","Joints","Curing"
Conference_Titel :
Electronics Technology (ISSE), 2011 34th International Spring Seminar on
Print_ISBN :
978-1-4577-2111-3
Electronic_ISBN :
2161-2536
DOI :
10.1109/ISSE.2011.6053562