Studies of surface mount technology and its risk analysis

Surface mount technology is commonly used technology in electronics assembly. It is a method where the components are mounted directly onto the surface of printed circuit board. This article deals with risk analysis of surface mount technology in electronics assembly. Risk analysis applies many methods of analysis with the focus on potential hazards. Its aim is to improve understanding of process and improve managing it. Risk is acceptable in case that it has a low impact on the process. In this article we try to highlight several problems, which happen in the surface mount technology during the design of electronics circuits and which have the bad influence on the total quality. We try to highlight problems during the production as well.