• DocumentCode
    3644151
  • Title

    Homogeneity of joints made of electrically conductive adhesive

  • Author

    Pavel Žák;Marek Tučan;Ivan Kudláček

  • Author_Institution
    Department of Electrotechnology, Czech Technical University in Prague, Czech Republic
  • fYear
    2011
  • fDate
    5/1/2011 12:00:00 AM
  • Firstpage
    225
  • Lastpage
    228
  • Abstract
    Reliability of conductive joints manufactured using electrically conductive adhesives (ECAs) depends mainly on their internal homogeneity. During tests of the reliability of ECAs, a significant incidence of internal inhomogeneities was observed in the joints made by one and two-component adhesives. The reason for the formation of bubbles in the ECAs joints are manufacturer recommended procedures used prior to the preparation of adhesives, processes for deposition of adhesive and the curing process of adhesive. This article presents the results of experiments aimed at research on the causes and consequences of inhomogeneity of ECA joints, and specification of procedures to minimize them. Tested samples were created by one-component (AX 20) and two-component (AX 12 LVT) adhesive, where on the two-component adhesive was studied also the influence of date of the expiration. Homogeneity of the joints was studied both by optical analysis of thin sections and by measuring the shear strength. Test results show that the inhomogeneity is greatest in one-component adhesive. Due to changes in viscosity during the curing process, the one-component adhesive gets under the mounting component. In extreme case this can cause even a short circuit. A similar phenomenon also occurs in two-component adhesives, though on a smaller scale.
  • Keywords
    "Joints","Viscosity","Curing","Conductive adhesives","Epoxy resins","Reliability"
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology (ISSE), 2011 34th International Spring Seminar on
  • ISSN
    2161-2528
  • Print_ISBN
    978-1-4577-2111-3
  • Electronic_ISBN
    2161-2536
  • Type

    conf

  • DOI
    10.1109/ISSE.2011.6053863
  • Filename
    6053863