Mechanical stress tests of SMT attachments

This paper covers experiments conducted on the specimens of different lead-free SMT assembly technologies. This research aimed specifically at the properties of lead-free solders and Electrically Conductive Adhesives (ECA) subjected to mechanical stress, applied as cyclic bending of experimental circuit boards. The experiment performed in past showed different properties of both technologies and their influence on the reliability of electronic devices under mechanical stress. These experiments are closely connected with the influence of thermal-induced mechanical stress on the reliability of electronic circuits.