• DocumentCode
    3644159
  • Title

    Reliability of SnAgCu solder joints during vibration in various temperature

  • Author

    Przemyslaw Matkowski

  • Author_Institution
    Faculty of Microsystem Electronics and Photonics/Wroclaw University of Technology, Poland
  • fYear
    2011
  • fDate
    5/1/2011 12:00:00 AM
  • Firstpage
    341
  • Lastpage
    347
  • Abstract
    The results of study focused on reliability of SnAgCu/ImSn (1206 and 0805 SMD) solder joints subjected to vibration in various but constant temperature (-40 and +130) will be presented. The results will be also compared with the results of author´s previous reliability tests focused on reliability of SnAgCu solder joints subjected to vibration combined with temperature cycles. Time to failure will be measured using dedicated event detector. After the tests solder joints will be inspected using ultra high-resolution nanofocus® X-ray inspection system and nanoCT®.
  • Keywords
    "Vibrations","Soldering","Reliability","Tin","Resistance","Loading","Temperature measurement"
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology (ISSE), 2011 34th International Spring Seminar on
  • ISSN
    2161-2528
  • Print_ISBN
    978-1-4577-2111-3
  • Electronic_ISBN
    2161-2536
  • Type

    conf

  • DOI
    10.1109/ISSE.2011.6053885
  • Filename
    6053885
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3644159