Title :
Reliability of SnAgCu solder joints during vibration in various temperature
Author :
Przemyslaw Matkowski
Author_Institution :
Faculty of Microsystem Electronics and Photonics/Wroclaw University of Technology, Poland
fDate :
5/1/2011 12:00:00 AM
Abstract :
The results of study focused on reliability of SnAgCu/ImSn (1206 and 0805 SMD) solder joints subjected to vibration in various but constant temperature (-40 and +130) will be presented. The results will be also compared with the results of author´s previous reliability tests focused on reliability of SnAgCu solder joints subjected to vibration combined with temperature cycles. Time to failure will be measured using dedicated event detector. After the tests solder joints will be inspected using ultra high-resolution nanofocus® X-ray inspection system and nanoCT®.
Keywords :
"Vibrations","Soldering","Reliability","Tin","Resistance","Loading","Temperature measurement"
Conference_Titel :
Electronics Technology (ISSE), 2011 34th International Spring Seminar on
Print_ISBN :
978-1-4577-2111-3
Electronic_ISBN :
2161-2536
DOI :
10.1109/ISSE.2011.6053885
