DocumentCode :
3644755
Title :
TSV modeling (T-VI)
Author :
Zhen Mu;Sheldon Tan
Author_Institution :
Mentor Garphics Corporation, San Jose, USA
fYear :
2011
Firstpage :
99
Lastpage :
100
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2011 IEEE 20th Conference on
ISSN :
pending
Print_ISBN :
978-1-4244-9398-2
Type :
conf
DOI :
10.1109/EPEPS.2011.6100197
Filename :
6100197
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3644755
