Reliability model for assessment of lifetime of lead-free solder joints

Legal limitation on dangerous substance resulted into ban on use of lead soldering alloy in electrical industry. The era of lead-free alloys based on tin is coming. Lead-free solders are “young” and their characteristics haven´t been surveyed sufficiently yet. Many research teams try to answer an easy question: “How reliable the lead-free solders are?” The given study deals with possible ways of prediction of solder joint made by lead-free alloy SAC 305 lifetime. By combination of several predictive methods we can check up on solder joint lifetime data acquired by different ways and efficiency of methods itself. Experimental, computerized and analytical methods were treated in the study and they proved coincident results.