DocumentCode
3646299
Title
Sintering process of silver nanoparticles in ink-jet printed conductive microstructures - Molecular dynamics approach
Author
Tomasz Falat;Bartosz Platek;Jan Felba
Author_Institution
Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, ul.Janiszewskiego 11/17, 50-372, Poland
fYear
2012
fDate
4/1/2012 12:00:00 AM
Firstpage
42374
Lastpage
42495
Abstract
The electronic microstructures performed by ink-jet printing nanosilver-contained inks are nonconductive just after the printing. To obtain good electrical conductivity they require the additional energy, mostly supplied during a heating process in relatively high temperature (above 200°C). Such high temperature is not convenient for the most polymers which would play a role of flexible substrates for circuits performed by ink-jet printing technique. The better understanding of sintering process is required to reduce this temperature to a more acceptable. The deep study on the sintering process of silver nanoparticles seems to be useful for further activities towards the reducing process temperature. Within this paper the sintering process of commercially available ink (AX JP-6n, produced by Amepox Microelectronics Ltd.) were investigated. The activation energy of two stages of sintering process were estimated. The experimental results were complemented with the results obtained within molecular dynamics simulations. The molecular dynamics were used for calculations of electrostatic energy between ligands and silver nanoparticles. The Material Studio from Accelerys software were used. Calculations were performed by using the three dimensional model containing the surface made of silver and one particle of ligand.
Keywords
"Heating","Particle measurements","Atmospheric measurements","Size measurement"
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on
Print_ISBN
978-1-4673-1512-8
Type
conf
DOI
10.1109/ESimE.2012.6191782
Filename
6191782
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