• DocumentCode
    3646299
  • Title

    Sintering process of silver nanoparticles in ink-jet printed conductive microstructures - Molecular dynamics approach

  • Author

    Tomasz Falat;Bartosz Platek;Jan Felba

  • Author_Institution
    Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, ul.Janiszewskiego 11/17, 50-372, Poland
  • fYear
    2012
  • fDate
    4/1/2012 12:00:00 AM
  • Firstpage
    42374
  • Lastpage
    42495
  • Abstract
    The electronic microstructures performed by ink-jet printing nanosilver-contained inks are nonconductive just after the printing. To obtain good electrical conductivity they require the additional energy, mostly supplied during a heating process in relatively high temperature (above 200°C). Such high temperature is not convenient for the most polymers which would play a role of flexible substrates for circuits performed by ink-jet printing technique. The better understanding of sintering process is required to reduce this temperature to a more acceptable. The deep study on the sintering process of silver nanoparticles seems to be useful for further activities towards the reducing process temperature. Within this paper the sintering process of commercially available ink (AX JP-6n, produced by Amepox Microelectronics Ltd.) were investigated. The activation energy of two stages of sintering process were estimated. The experimental results were complemented with the results obtained within molecular dynamics simulations. The molecular dynamics were used for calculations of electrostatic energy between ligands and silver nanoparticles. The Material Studio from Accelerys software were used. Calculations were performed by using the three dimensional model containing the surface made of silver and one particle of ligand.
  • Keywords
    "Heating","Particle measurements","Atmospheric measurements","Size measurement"
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on
  • Print_ISBN
    978-1-4673-1512-8
  • Type

    conf

  • DOI
    10.1109/ESimE.2012.6191782
  • Filename
    6191782