Planar interconnects to 3D interconnects

Summary form only given. Envisioning greater functionality, higher performance and lower power consumption, the semiconductor industry is introducing the first products with 3D interconnects into volume manufacturing. This presentation will trace the transition from planar to 3D interconnects by beginning with the key issues which confronted the scaling of 2D interconnects. The second part of the talk will cover the current status and the enablement of the supply chain, The final part of this presentation will discuss the potential trends for 3D IC in the future years.