Title :
Some criteria of topology selection for hybrid converters
Author :
S. Radosevic;M. Lazic;R. Ramovic
Author_Institution :
Telecommun. & Electron. Inst., Belgrade, Yugoslavia
Abstract :
A new concept of telecommunications exchange, based on the distributed power supply idea is discussed. This concept brings a considerable increase of telecommunications exchange reliability. An analysis of thick film hybrid technology for realization of DC/DC converters is presented. Buck and boost converters, flyback converters, forward converters, push-pull converters, and Cuk converters are discussed.
Keywords :
"Power supplies","Switches","Telecommunications","Circuit topology","Thickness control","Thick film circuits","Electrical capacitance tomography","Electronic packaging thermal management","Noise reduction","Power electronics"
Conference_Titel :
Microelectronics, 1997. Proceedings., 1997 21st International Conference on
Print_ISBN :
0-7803-3664-X
DOI :
10.1109/ICMEL.1997.625283
