DocumentCode
3648175
Title
Effects of reflow soldering methods on the lifetime of capacitors
Author
Rajmond Jánó;Dan Pitică;Paul Svasta;Gaudentiu Vărzaru
Author_Institution
Applied Electronics Department, Technical University of Cluj-Napoca, Romania
fYear
2012
fDate
5/1/2012 12:00:00 AM
Firstpage
183
Lastpage
188
Abstract
The influences of different soldering methods and specific thermal profiles were investigated on the lifetime of through hole capacitors. The behavior of aluminum electrolytic, ceramic and two capacitor types with different plastic dielectric capacitors were evaluated when using alternative soldering methods instead of the standard wave soldering process, such as vapour phase or infrared convection. The changes in the values of capacitance and ESR of the capacitors were monitored before and after soldering and the influence of the different techniques on their lifetimes was assessed.
Keywords
"Capacitors","Capacitance","Soldering","Cooling","Aluminum","Temperature","Thermal stresses"
Publisher
ieee
Conference_Titel
Electronics Technology (ISSE), 2012 35th International Spring Seminar on
ISSN
2161-2528
Print_ISBN
978-1-4673-2241-6
Electronic_ISBN
2161-2536
Type
conf
DOI
10.1109/ISSE.2012.6273135
Filename
6273135
Link To Document