• DocumentCode
    3648175
  • Title

    Effects of reflow soldering methods on the lifetime of capacitors

  • Author

    Rajmond Jánó;Dan Pitică;Paul Svasta;Gaudentiu Vărzaru

  • Author_Institution
    Applied Electronics Department, Technical University of Cluj-Napoca, Romania
  • fYear
    2012
  • fDate
    5/1/2012 12:00:00 AM
  • Firstpage
    183
  • Lastpage
    188
  • Abstract
    The influences of different soldering methods and specific thermal profiles were investigated on the lifetime of through hole capacitors. The behavior of aluminum electrolytic, ceramic and two capacitor types with different plastic dielectric capacitors were evaluated when using alternative soldering methods instead of the standard wave soldering process, such as vapour phase or infrared convection. The changes in the values of capacitance and ESR of the capacitors were monitored before and after soldering and the influence of the different techniques on their lifetimes was assessed.
  • Keywords
    "Capacitors","Capacitance","Soldering","Cooling","Aluminum","Temperature","Thermal stresses"
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology (ISSE), 2012 35th International Spring Seminar on
  • ISSN
    2161-2528
  • Print_ISBN
    978-1-4673-2241-6
  • Electronic_ISBN
    2161-2536
  • Type

    conf

  • DOI
    10.1109/ISSE.2012.6273135
  • Filename
    6273135