DocumentCode
3648989
Title
Performance of InP/GaAsSb DHBTs Planarized with Teflon AF Compared to DHBTs with Airbridge Interconnects
Author
R. Lövblom;R. Flückiger;M. Alexandrova;C. R. Bolognesi
Author_Institution
Millimeter-Wave Electron. Group (MWE), ETH Zurich, Zü
fYear
2012
Firstpage
1
Lastpage
4
Abstract
We compare the DC and RF performance of InP/GaAsSb/InP DHBTs fabricated in a Teflon AF planarization process to identical DHBTs with airbridge interconnects. No statistically significant difference in performance was observed, proving that the Teflon AF layer does not degrade the devices. Multi-layer deposition and dry etching of Teflon AF were investigated to explore the suitability of Teflon AF as an interlevel dielectric in DHBT based MMICs.
Keywords
"Indium phosphide","Double heterojunction bipolar transistors","Films","Silicon","Junctions","Planarization","Etching"
Publisher
ieee
Conference_Titel
Compound Semiconductor Integrated Circuit Symposium (CSICS), 2012 IEEE
ISSN
1550-8781
Print_ISBN
978-1-4673-0928-8
Type
conf
DOI
10.1109/CSICS.2012.6340085
Filename
6340085
Link To Document