Title :
Thermal modeling of through hole capacitors
Author :
Jánó Rajmond;Pitică Dan
Author_Institution :
Applied Electronics Department, Technical University of Cluj-Napoca, Cluj-Napoca, Romania
Abstract :
Through the course of this paper transient thermal conditions were investigated for through hole capacitor models built in SolidWorks. Firstly, the influences of the shape, casing material are determined, after which lifelike models for aluminum electrolytic, ceramic and plastic film capacitors are built and their efficiency regarding forced cooling and thermal power dissipation is investigated.
Keywords :
"Capacitors","Thermal resistance","Immune system","Aluminum","Materials","Shape","Cooling"
Conference_Titel :
Design and Technology in Electronic Packaging (SIITME), 2012 IEEE 18th International Symposium for
Print_ISBN :
978-1-4673-4757-0
DOI :
10.1109/SIITME.2012.6384381
