Title :
Passive alignment packaging on Si optical bench using AuSn solder bumps
Author :
M. Itoh;J. Sasaki;A. Uda
Author_Institution :
Opto-Electron. Res. Labs., NEC Corp., Kanagawa, Japan
Abstract :
Precise passive alignment packaging technology on a Si optical bench has been developed using novel AuSn solder-bump flip-chip bonding. High accuracy (/spl plusmn/1 /spl mu/m) in the horizontal and vertical alignment of an optical chip was attained.
Keywords :
"Packaging","Bonding"
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1997. LEOS ´97 10th Annual Meeting. Conference Proceedings., IEEE
Print_ISBN :
0-7803-3895-2
DOI :
10.1109/LEOS.1997.645300
