• DocumentCode
    3649945
  • Title

    Passive alignment packaging on Si optical bench using AuSn solder bumps

  • Author

    M. Itoh;J. Sasaki;A. Uda

  • Author_Institution
    Opto-Electron. Res. Labs., NEC Corp., Kanagawa, Japan
  • Volume
    2
  • fYear
    1997
  • Firstpage
    126
  • Abstract
    Precise passive alignment packaging technology on a Si optical bench has been developed using novel AuSn solder-bump flip-chip bonding. High accuracy (/spl plusmn/1 /spl mu/m) in the horizontal and vertical alignment of an optical chip was attained.
  • Keywords
    "Packaging","Bonding"
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics Society Annual Meeting, 1997. LEOS ´97 10th Annual Meeting. Conference Proceedings., IEEE
  • ISSN
    1092-8081
  • Print_ISBN
    0-7803-3895-2
  • Type

    conf

  • DOI
    10.1109/LEOS.1997.645300
  • Filename
    645300
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3649945