• DocumentCode
    3650673
  • Title

    Professional development courses for the 63rd ECTC

  • fYear
    2013
  • Firstpage
    1
  • Lastpage
    1
  • Keywords
    "Integrated circuit modeling","Electronics packaging","Educational institutions","Semiconductor device reliability","Packaging","Continuing education"
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4799-0233-0
  • Type

    conf

  • DOI
    10.1109/ECTC.2013.6575535
  • Filename
    6575535
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3650673