Abstract :
The following topics are dealt with: logic technology; reliability; 3D systems and packaging; advanced CMOS technology: Ge FinFET; memory technology; PC RAM; contact-interconnect; ReRAM; nanowire FET; Si FinFET; magnetic tunnel junction; X-on insulator; 3D NAND Flash & other NVM; non-Si substrates: and III-V HEMT-FET-TFET.
