• DocumentCode
    36582
  • Title

    Spatial Memoization: Concurrent Instruction Reuse to Correct Timing Errors in SIMD Architectures

  • Author

    Rahimi, Azar ; Benini, Luca ; Gupta, R.K.

  • Author_Institution
    Dept. of Comput. Sci. & Eng., Univ. of California, San Diego, La Jolla, CA, USA
  • Volume
    60
  • Issue
    12
  • fYear
    2013
  • fDate
    Dec. 2013
  • Firstpage
    847
  • Lastpage
    851
  • Abstract
    This brief proposes a novel technique to alleviate the cost of timing error recovery, building upon the lockstep execution of single-instruction-multiple-data (SIMD) architectures. To support spatial memoization at the instruction level, we propose a single-strong-lane-multiple-weak-lane (SSMW) architecture. Spatial memoization exploits the value locality inside parallel programs, memoizes the result of an error-free execution of an instruction on the SS lane, and concurrently reuses the result to spatially correct errant instructions across MW lanes. Experiment results on Taiwan Semiconductor Manufacturing Company 45-nm technology confirm that this technique avoids the recovery for 62% of the errant instructions on average, for both error-tolerant and error-intolerant general-purpose applications.
  • Keywords
    error correction; SIMD architectures; SSMW architecture; concurrent instruction reuse; correct timing errors; errant instructions; error free execution; error intolerant general purpose applications; instruction level; lockstep execution; parallel programs; single instruction multiple data architectures; single strong lane multiple weak lane; spatial memoization; timing error recovery; value locality; Computer architecture; Energy management; Error analysis; Parallel processing; Spatial analysis; Timing; Instruction reuse; memoization; recovery; resilience; timing error correction;
  • fLanguage
    English
  • Journal_Title
    Circuits and Systems II: Express Briefs, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1549-7747
  • Type

    jour

  • DOI
    10.1109/TCSII.2013.2281934
  • Filename
    6617694