DocumentCode
3658555
Title
Adaptive sprinting: How to get the most out of Phase Change based passive cooling
Author
Fulya Kaplan;Ayse K. Coskun
Author_Institution
ECE Department, Boston University, MA, United States
fYear
2015
fDate
7/1/2015 12:00:00 AM
Firstpage
37
Lastpage
42
Abstract
CMOS scaling trends lead to elevated on-chip temperatures, which substantially limit the performance of today´s processors. To improve thermal efficiency, Phase Change Materials (PCMs) have recently been used as passive cooling solutions. PCMs store large amount of heat at near-constant temperature during phase change, allowing strategies such as computational sprinting. While existing sprinting methods allow short performance boosts, there is significant unexplored potential in improving performance on systems with PCM-enhanced cooling. To this end, this paper proposes a novel runtime management policy driven by observations that are not captured by prior techniques: (i) PCM melts non-uniformly due to spatially heterogeneous on-chip heat distribution; (ii) power consumption during sprinting is highly application dependent and assuming a fixed sprinting power leads to lower thermal efficiency; (iii) if we monitor the remaining PCM energy at various locations, we can utilize the PCM heat storage capability much more efficiently. The proposed Adaptive Sprinting policy exploits these observations to extend sprinting duration for increased performance gains. Our policy monitors the remaining PCM energy corresponding to each core at runtime, and using this information, it decides on the number, the location and the voltage-frequency (V/f) setting of the sprinting cores. Experimental evaluation including a detailed phase change thermal model demonstrates 29% performance improvement, 22% energy savings, and 43% energy delay product (EDP) reduction on average, compared to prior strategies.
Keywords
"Monitoring","Temperature measurement","Temperature sensors","Nickel"
Publisher
ieee
Conference_Titel
Low Power Electronics and Design (ISLPED), 2015 IEEE/ACM International Symposium on
Type
conf
DOI
10.1109/ISLPED.2015.7273487
Filename
7273487
Link To Document