DocumentCode
3659150
Title
Impact of H2 , O2 , and N2 anneals on atomic-scale surface flattening for 3-D Ge channel architecture
Author
Yukinori Morita;Hiroyuki Ota;Meishoku Masahara;Tatsuro Maeda
Author_Institution
Nanoelectronics Research Institute (NERI), National Institute of Advanced Industrial Sciences and Technology (AIST) Tsukuba West, 16-1 Onogawa, Tsukuba, Ibaraki 305-8569, Japan
fYear
2015
fDate
6/1/2015 12:00:00 AM
Firstpage
1
Lastpage
2
Abstract
We evaluated atomic-scale surface morphology changes of Ge wafers after thermal flattening in H2, O2, and N2 gas ambient. Analysis of atomic force microscopy results revealed that the atomic steps and terraces of Ge were evident after annealing at over 500°C for 160 s. The atomistic surface morphologies varied with the different annealing atmospheres. Nearly uniform step-terrace structure due to the suppression of terrace etching was obtained on N2-annealed Ge surfaces.
Keywords
"Surface morphology","Annealing","Rough surfaces","Surface roughness","Etching","Surface topography"
Publisher
ieee
Conference_Titel
Silicon Nanoelectronics Workshop (SNW), 2015
Type
conf
Filename
7275284
Link To Document