3D-TCAD simulation study of the novel T-FinFET structure for sub-14nm metal-oxide-semiconductor field-effect transistor

We propose a novel device structure, namely T-FinFET, for sub-14nm MOSFET with using lighter anti punch through (APT) implant. According to 3D TCAD simulation, the T-FinFET is found to posses many advantages over the normal FinFET, such as better short channel effect (SCE) and drain induced barrier lowering (DIBL), having smaller S/D capacitance and junction leakage and fewer masks. Compared to gate-all-around (GAA) structure, the T-FinFET also has compatible electrical performance. All these features are obtained by depositing a self-aligned (SA) oxide after recessing the Si fin in the S/D region. It can be applied to Ge and III-V MOSFETs for suppressing the SCEs and S/D leakage, arising from higher permittivity and lower band gap than Si.