• DocumentCode
    3659501
  • Title

    Efficient don´t-care filling method to achieve reduction in test power

  • Author

    Sinduja V;Siddharth Raghav; Anita J P

  • Author_Institution
    Department of ECE, Amrita Vishwa Vidyapeetham, Coimbatore, India
  • fYear
    2015
  • Firstpage
    478
  • Lastpage
    482
  • Abstract
    Since VLSI technology has become ubiquitous in today´s world, this field is a prime candidate for power reduction. Tremendous growth in chip density and reduction in dimensions contribute to an escalation in clock rate. Delay faults are detected using at-speed scan testing. This paper proposes a novel method to achieve power reduction during scan test by using x-filling. In this paper, ISCAS´89 benchmark circuits have been used with an industrial 90nm technology. The tools used were Synopsys TetraMAX and Synopsys Design Compiler. Experimental results show a considerable reduction in average shift power and average capture power.
  • Keywords
    "Switching circuits","Switches","Circuit faults","Filling","Testing","Power demand","Power dissipation"
  • Publisher
    ieee
  • Conference_Titel
    Advances in Computing, Communications and Informatics (ICACCI), 2015 International Conference on
  • Print_ISBN
    978-1-4799-8790-0
  • Type

    conf

  • DOI
    10.1109/ICACCI.2015.7275654
  • Filename
    7275654